Section 40 in Telecommunication Interconnection Regulations, 2018
40. In response to the issue as to which details should a new TSP furnish while placing request for entering into interconnection agreement, the stakeholders have expressed a variety of views. At one extreme is a stakeholder who has argued that the Authority should not prescribe details/documents to be furnished by a new entrant to the existing service provider; instead, these should be mutually decided and negotiated by the interconnecting service providers. On the other extreme are a few stakeholders who have suggested a new TSP should furnish a large number of details and documents including the following :
(a)letter issued by DoT intimating MSC SPC for every LSA;(b)letter issued by DoT intimating MSISDNs/TFN Levels/Fixed Number Series level allocation for provisioning subscribers;(c)company profile and market share;(d)TEC Interface approvals for all equipment to be connected for interconnection;(e)network architecture with low level and high level POP details;(f)projection of likely reasonable demand for Interconnect Location wise E1 capacity for six months post-commercial launch (locations should be given with detailed Address and latitude-longitude);(g)likely date of start of commercial operations;(h)services proposed to be offered and proposed connectivity (with justifications);(i)Interconnecting technology, for example, TDM/IP, SMPP, ISUP, SCCP, etc.;(j)details of transport media such as satellite, Microwave, PDH, SDH, DWDM, ATM, etc.;(k)KYC documents of the requesting service provider viz. Service Tax Certificate/PAN Card/GST Registration Certificate etc.(l)a copy of Memorandum of Association of the Company;(m)a copy of Article of Association,(n)the latest Annual report of the Company,(o)a list of Directors with DIN,(p)a certified true copy of Board resolution,(q)original Power of Attorney,(r)specimen signature,(s)copy of Incorporation Certificate with CIN
