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Applications, which are exempted from therequirements of sub-rule (1) of rule 16
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Substance |
| 1 |
Mercury in single capped (compact) fluorescent lamps notexceeding (per burner):
|
| 1(a) |
For general lighting purposes <30 W : 2.5 mg |
| 1(b) |
For general lighting purposes≥30 W and <50 W : 3.5mg |
| 1(c) |
For general lighting purposes≥50 W and <150 W : 5mg |
| 1(d) |
For general lighting purposes≥150W : 15 mg
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| 1(e) |
For general lighting purposes with circular or squarestructural shape and tube diameter≤17mm : 7mg
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| 1(f) |
For special purposes:5 mg |
| 2(a) |
Mercury in double-capped linear fluorescent lamps for generallighting purposes not exceeding (per lamp):
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| 2(a)(1) |
Tri-band phosphor with normal life time and a tube diameter<9mm (e.g. T2): 4mg |
| 2(a)(2) |
Tri-band phosphor with normal life time and a tube diameter≥9 mm and≤17 mm(e.g. T5): 3 mg
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| 2(a)(3) |
Tri- band phosphor with normal life time and a tube diameter>17 mm and≤28mm(e.g. T8): 3.5 mg
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| 2(a)(4) |
Tri-band phosphor with normal life time and a tube diameter>28 mm (e.g. T 12):3.5 mg
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| 2(a)(5) |
Tri-band phosphor with long life time (≥25000h):5mg
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| 2(b) |
Mercury in other fluorescent lamps not exceeding(per lamp): |
| 2(b)(1) |
Linear halophosphate lamps with tube >28 mm (e.g. T 10 andT12):10 mg
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| 2(b)(2) |
Non-linear halophosphate lamps(all diameters):15mg |
| 2(b)(3) |
Non-linear tri-band phosphor lamps with tube diameter >17mm(e.g.T9): 15 mg
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| 2(b)(4) |
Lamps for other general lighting and special purposes (e.g.induction lamps):15mg
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| 3 |
Mercury in cold cathode fluorescent lamps and externalelectrode fluorescent lamps (CCFL and EEFL)for special purposesnot exceeding (per lamp):
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| 3(a) |
Short length( < 500 mm):3.5mg |
| 3(b) |
Medium length(>500 mm and<1500 mm): 5mg |
| 3(c) |
Long length(>1500 mm): 13mg |
| 4(a) |
Mercury in other low pressure discharge lamps (per lamp): 15mg |
| 4(b) |
Mercury in High Pressure Sodium(vapour) lamps for generallighting purposes not exceeding (per burner)in lamps withimproved colour rendering index Ra>60:
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| 4(b)-I |
P≤155 W : 30 mg |
| 4(b)-II |
155 W < P <405 W : 40 mg |
| 4(b)-III |
P >405 W: 40 mg |
| 4(c) |
Mercury in other High Pressure Sodium(vapour)lamps for generallighting purposes not exceeding (per burner):
|
| 4(c)-I |
P<155 W:25mg |
| 4(c)-II |
155 W < P < 405 W:30 mg |
| 4(c)-III |
P >405 W:40 mg |
| 4(d) |
Mercury in High Pressure Mercury (vapour) lamps (HPMV) |
| 4(e) |
Mercury in metal halide lamps (MH) |
| 4(f) |
Mercury in other discharge lamps for special purposes notspecifically mentioned in this Schedule
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| 5(a) |
Lead in glass of cathode ray tubes |
| 5(b) |
Lead in glass of fluorescent tubes not exceeding 0.2% byweight
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| 6(a) |
Lead as an alloying element in steel for machining purposesand in galvanized steel containing up to 0.35% lead by weight
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| 6(b) |
Lead as an alloying element in aluminium containing up to 0.4%lead by weight
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| 6(c) |
Copper alloy containing up to 4% lead by weight |
| 7(a) |
Lead in high melting temperature type solders (i.e. lead-basedalloys containing 85% by weight or more lead)
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| 7(b) |
Lead in solders for servers, storage and storage arraysystems, network infrastructure equipment for switching,signalling, transmission, and network management fortelecommunications
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| 7(c)-I |
Electrical and electronic components containing lead in aglass or ceramic other than dielectric ceramic in capacitors,e.g. piezo electronic devices, or in a glass or ceramic matrixcompound.7(c)-II Lead in dielectric ceramic in capacitors for arated voltage of 125 V AC or 250 V DC or higher
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| 7(c)-III |
Lead in dielectric ceramic in capacitors for a rated voltageof less than 125 V AC or 250 V DC
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| 8(a) |
Cadmium and its compounds in one shot pellet type thermalcut-offs
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| 8(b) |
Cadmium and its compounds in electrical contracts |
| 9 |
Hexavalent chromium as an anti-corrosion agent of the carbonsteel cooling system in absorption refrigerators up to 0.75% byweight in the cooling solution
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| 9(b) |
Lead in bearing shells and bushes for refrigerant-containingcompressors for heating, ventilation, air conditioning andrefrigeration (HVACR) application.
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| 11(a) |
Lead used in C-press compliant pin connector systems |
| 11(b) |
Lead used in other than C-press compliant pin connectorsystems
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| 12 |
Lead as a coating material for the thermal conduction moduleC- ring
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| 13(a) |
Lead in white glasses used for optical applications |
| 13(b) |
Cadmium and lead in filter glasses and glasses used forreflectance standards.
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| 14 |
Lead in solders consisting of more than two elements for theconnection between the pins and the package of microprocessorswith a lead content of more than 80% and less than 85% by weight
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| 15 |
Lead in solders to complete a viable electrical connectionbetween semiconductor die and carrier within integrated circuitflip chip packages.
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| 16 |
Lead in linear incandescent lamps with silicate coated tubes |
| 17 |
Lead halide as radiant agent in high intensity discharge (HID)lamps used for professional reprography applications.
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| 18(a) |
Lead as activator in the fluorescent powder (1% lead by weightor less) of discharge lamps when used as specialty lamps fordiazoprinting reprography, lithography, insect traps,photochemical and curing processes containing phosphors such asSMS ((Sr, Ba)2Mg Si2O7:Pb)
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| 18(b) |
Lead as activator in the fluorescent powder (1% lead by weightor less) of discharge lamps when used as sun tanning lampscontaining phosphors such as BSP (Ba Si2O5:Pb)
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| 19 |
Lead with PbBiSn-Hg and PblnSn-Hg in specific compositions asmain amalgam and with PbSn-Hg as auxiliary amalgam in verycompact energy saving lamps (ESL)
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| 20 |
Lead oxide in glass used for bonding front and rear substratesof flat fluorescent lamps used for Liquid Crystal Displays (LCDs)
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| 21 |
Lead and cadmium in printing inks for the application ofenamels on glasses, such as borosilicate and soda lime glasses
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| 22 |
Lead in finishes of fine pitch components other thanconnectors with a pitch of 0.65 mm and less
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| 23 |
Lead in solders for the soldering to machined through holediscoidal and planar array ceramic multilayer capacitors
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| 24 |
Lead oxide in surface conduction electron emitter displays(SED) used in structural elements, notably in the seal frit andfrit ring.
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| 25 |
Lead oxide in the glass envelope of black light blue lamps |
| 26 |
Lead alloys as solder for transducers used in high-powered(designated to operate for several hours at acoustic power levelsof 125 dB SPL and above) loudspeakers
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| 27 |
Lead bound in crystal glass |
| 28 |
Cadmium alloys as electrical/mechanical solder joints toelectrical conductors located directly on the voice coil intransducers used in high-powered loudspeakers with sound pressurelevels of 100 dB(A) and more
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| 29 |
Lead in soldering materials in mercury free flat fluorescentlamps (which e.g. are used for liquid crystal displays, design orindustrial lighting)
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| 30 |
Lead oxide in seal frit used for making window assemblies forArgon and Krypton laser tubes
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| 31 |
Lead in solders for the soldering of thin copper wires of 100µm diameter andless in power transformers
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| 32 |
Lead in cermet-based trimmer potentiometer elements |
| 33 |
Mercury used as a cathode sputtering inhibitor in DC plasmadisplays with a content up to 30 mg per display
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| 34 |
Lead in the plating layer of high voltage diodes on the basisof a zinc borate glass body
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| 35 |
Cadmium and cadmium oxide in thick film pastes used onaluminium bonded beryllium oxide
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| 36 |
Cadmium in colour converting II-VI LEDs (<10µgCd per mm²oflight-emitting area) for use in solid state illumination ordisplay systems.
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